Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Томи 1 – 2American Society of Mechanical Engineers., 1997 |
Зміст
VOLUME | 1 |
RELIABILITY OF DCAUNDERFILLED PACKAGES | 23 |
PACKAGING TECHNOLOGY | 37 |
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Advances in Electronic Packaging: Proceedings of the ..., Томи 1 – 2 Перегляд фрагмента - 1995 |
Advances in Electronic Packaging: Proceedings of the ..., Томи 1 – 2 Перегляд фрагмента - 1997 |
Advances in Electronic Packaging: Proceedings of the ..., Томи 1 – 3 Перегляд фрагмента - 2001 |
Загальні терміни та фрази
adhesive Advances in Electronic alignment analysis applications array assembly ball Ball Grid Array circuit components connector cost coupling curing cycles delamination density developed devices die attach disk EEP-Vol effect electrical electroless Electronic Packaging element encapsulant epoxy etch fabrication failure film flip chip flow fly height frequency function glass heat IEEE increase input integrated interface JEDEC joint laser laser diode layer magnetic manufacturing material measured mechanical metal method mode module molding optical fiber optical interconnects optoelectronic output pads parameters parylene performance plastic plate polyimide polymer PQFP printed circuit board reflow reliability resistance samples semiconductor shown in Figure shows signal silicon simulation solder ball solder bump stress structure substrate surface switches tapered techniques temperature thermal thickness transmission typical underfill VCSEL Volume 1 ASME wafer waveguide wire bonding