Proceedings of the ASME Heat Transfer Division, Том 7

acoustic streaming ambient attach auxiliary plate average ballistic-diffusive Boltzmann equation bottom boundary conditions calculated channel components computational condenser configuration cooling copper decrease device diameter die attach dissipation effect electronic energy equation evaporator experimental Figure flip chip fluid GaAs grid heat conduction heat flux heat pipe heat sink heat source heat transfer coefficient heater HTD-Vol impinging jet increase inlet interconnect interface jet impingement Journal of Heat layer liquid maximum measured MESFET metal mm² natural convection NONDIMENSIONAL nozzle Nusselt number package parameters phonon predict ratio region Reynolds number semiconductor shown in Fig shows silicon simulation substrate superlattice surface temperature distribution temperature field temperature profiles thermal conductivity thermal contact conductance thermal grease thermal performance thermal resistance thermocouples thermosyphon thickness transient tube two-phase unsteady values vapor chamber VCSEL velocity vertical W/cm² W/m² wall temperature wire bonded