Understanding Fabless IC Technology
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless ICs are those designed and marketed by one company but actually manufactured by another.
*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members
*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations
*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control
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PART 2 An InDepth Understanding of the Fabless Semiconductor Business Model
PART 3 Becoming a BestinClass Fabless Company
A Look into the Future
Overall Semiconductor Revenues in 2006 Public Companies
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analog assembly and test Automation back-end Broadcom business model buyer capability challenges changes chip CMOS company’s complex core Corporation cost cycle Cypress delivery design services device EDA tools electronic electronic design automation embedded memory enable engineering environment equipment example fabless business model fabless companies Fabless IC Technology fabless model fabless semiconductor companies Figure forecast foundry manager functionality GDSII IDMs implementation infrastructure integrated circuit Internet investment issues Logic Maintenance Moore’s Law multiple NASDAQ operations outsourcing package partners per-use percent performance physical design planning process technology processor Programmable Logic Device requirements revenue royalties semiconductor industry Semiconductor Manufacturing silicon SIP License Agreement SIP product Source specific SRAM standard subcontractor suppliers supply chain tapeout third-party IP today’s transistors TranSwitch TSMC typically Understanding Fabless updates vendors wafer warranty Xilinx yield